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For these causes, BIS is introducing ECCN 3A904 on the CCL to regulate cryogenic cooling systems and specified components. ECCN 3A904 controls “devices rated to offer a cooling energy higher than or equivalent to 600 µW at or beneath a temperature of 0.

4D001 “application”. Paragraph 4D001.a is revised by adding ECCN 4A906 on the exception parenthetical for 4D.

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License needs for considered exports and considered reexports for nationwide protection and regional security controls are discussed in area G of this rule, given that the license needs are similar for both of those.

specialized Notice: with the reasons of 3E001 and 3E905, a `Process layout package' (`PDK') is actually a application Software supplied by a semiconductor maker making sure that the needed style practices and guidelines are taken into consideration in an effort to properly develop a specific integrated circuit style in a certain semiconductor method, in accordance with technological and producing constraints (Every semiconductor production procedure has its read more unique `PDK').

e. “Technology” to the “advancement” of integration “software package” for incorporation of specialist devices for Innovative selection assist of shop ground functions into “numerical Management” units;

h. Multi-layer masks which has a stage change layer not specified by 3B001.g and developed ( print website page 72950) to be used by lithography machines using a light-weight source wavelength below 245 nm; Note: 3B001.

z. Any commodity explained in 3A001 that fulfills or exceeds the overall performance parameters in 3A090, as follows:

Masks and reticles are Every single made out of advanced multiple layer mask blanks. They need to be made for “Excessive ultraviolet” (“EUV”) lithography. As masks and reticles are vital elements for EUV lithography, BIS is introducing 3B001.

2E910 “Technology”, not specified in other places, “specifically built” or modified to the “advancement” or “creation” of apparatus specified in ECCN 2B910.

The report must consist of the next: (1) The name, deal with and issue of contact of your entity that designed the release;

f. “technological know-how” for the applying of inorganic overlay coatings or inorganic floor modification coatings (laid out in column 3 of the subsequent table) to non-electronic substrates (laid out in column two of the next desk), by processes specified in column 1 of the next table and outlined while in the complex Take note.

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